Advanced Packaging

Advanced Packaging

4.11 - 1251 ratings - Source

Advanced Packaging serves the semiconductor packaging, assembly and test industry. Strategically focused on emerging and leading-edge methods for manufacturing and use of advanced packages.Electronics, Inc. These include thermal interface material (grease, silicon pad), heatsinks made of finned aluminum on the ... For a device with many I/Os to surface area, such as a BGA or LGA, if you do nothing but build a standard socket , theanbsp;...

Title:Advanced Packaging
Publisher: - 2007-05


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