From the reviews: qThis book is intended for an assembly production house setting, appropriate for management, designers, chief operators, as well as wirebond production engineers. Operational issues such as specifying and optimizing wire and automatic bonders for a product line are included. The book is very good with qvisualq explanations for quick grasping of the issues. In addition, the fundamental metallurgical or mechanical root causes behind material and process choices are presented. The book has a clear prose style and a very readable font and page layout. The figures, although effective, are simply low resolution screen prints from a personal computer and thus have aliasing and fuzziness. This book has excellent overall tutorial and enough description of wire and bonding equipment so the reader could specify and negotiate correctly for with suppliers. The majority of the book dwells on establishing the bonding process for a particular product; determining the qwindowq of adjustments. The book ends with discussions on establishing quality metrics and reliability assurance tests. Each chapter of the book includes enough tutorial information to allow it to alone with little need to page backwards. A short but good reference section is at the end. If you have not read a wirebonding book, or the one you read 10 years ago was borrowed and never returned, now is the time to buy this book.q ( CMPT Newsletter, June 2005)Here we give an example of how to write and what to include in a Wire bonder requirement specification for high pin count fine pitch applications. ... The parameter of each system must be used also in manual mode double row pad bonding.
|Title||:||Advanced Wirebond Interconnection Technology|
|Author||:||Shankara K. Prasad|
|Publisher||:||Springer Science & Business Media - 2006-05-10|