Advances in Electronic Circuit Packaging

Advances in Electronic Circuit Packaging

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Encapsulants for Electronic Packaging GEORGE R. DALLIMORE Lockheed Missile and Space Company Sunnyvale, California Many types and classes of embedding compounds are available for encapsulating electronic packages. For a particular ... Encapsulants should be selected on the basis of a detailed technical analysis of the electrical, mechanical, thermal, and environmental requirements.

Title:Advances in Electronic Circuit Packaging
Author:Lawrence L. Rosine
Publisher:Springer - 2013-12-01


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