Encapsulants for Electronic Packaging GEORGE R. DALLIMORE Lockheed Missile and Space Company Sunnyvale, California Many types and classes of embedding compounds are available for encapsulating electronic packages. For a particular ... Encapsulants should be selected on the basis of a detailed technical analysis of the electrical, mechanical, thermal, and environmental requirements.
|Title||:||Advances in Electronic Circuit Packaging|
|Author||:||Lawrence L. Rosine|
|Publisher||:||Springer - 2013-12-01|