Advances in Electronic Packaging

Advances in Electronic Packaging

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Obviously, if this thickness were reduced to near zero the internal resistance would be at its lowest value. ... thermal paste) creates a relatively large thermal resistance, since at this point the thermal energy has not been given the opportunity to spread out into a ... There was very little concern for the thermal characteristics - the heat transfer rates were quite low. Today however, many single chip modules are placed on a single card and each is required to dissipate much more heat.

Title:Advances in Electronic Packaging
Author:Ephraim Suhir, American Society of Mechanical Engineers. Electrical and Electronic Packaging Division
Publisher:American Society of Mechanical Engineers - 1997


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