Annual Technical Conference

Annual Technical Conference

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Materials studied by thermomechanical analysis included epoxy compounds MH20245P, A1177B, XPE-370, urethane adhesive XAU-107, and alkyd P-750. Initially, the P-750 had a Tg too high for the laboratory equipment to measureanbsp;...

Title:Annual Technical Conference
Author:Society of Plastics Engineers
Publisher: - 1977


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