Proceedings of the 1996 WRI International Symposium held in New York City, September 11-13, 19962 New Interconnects for Multilayer MMIC Multilayer MMICs need to use metal planes between circuit layers in order to ... Presence of these metal planes can introduce parallel-plate modes, which can result in transversal power leakage [7, 8] problems. ... waveguides, are used for signal transmission in such multilayer dielectric- metal environment, power can escape from ... Though this is an issue for fabrication of hybrid-type of multilayer circuits using phtoetching process, it should notanbsp;...
|Title||:||Directions for the Next Generation of MMIC Devices and Systems|
|Author||:||Nirod K. Das, Henry L. Bertoni|
|Publisher||:||Springer - 1997-11-30|