This is an authoritative reference source of practical information on the materials and processes of microelectronic packaging. Its 117 articles offer the collective knowledge, wisdom, and judgment of 407 expert microelectronics packaging authors, co-authors, and reviewers. This multi-author approach ensures the best, most timely information throughout. Panels of experts reviewed each article for technical accuracy, generic point of view, and completeness. A glossary of terms and definitions common to this field will be a much used reference source. Book jacket.The major function of an SMT adhesive is to position and hold the component for wave soldering. ... the assembly ac Handling characteristics needed with user- specified process ac Reworkability for in-house and field repairs Adhesive Types Theanbsp;...
|Title||:||Electronic Materials Handbook|
|Publisher||:||ASM International - 1989-11-01|