As an example of this approach, consider the curing of a multilayer printed wiring board consisting of symmetric outer layers of ... Figure 9 shows the results of heating more gradually at 6 AdC/min (10 AdF/min) until 0.8 U3 As 0.6 agt; | 0.4 03 DC 0.2 500 1000 1500 ... J.B. Enns and J.K. Gillham, Time Temperature Transformation (1 1 1 ) Cure Diagram: Modeling the Cure Behavior of Thermosets, J. Appl. Polym. ... R. Fullerton, D. Roylance, A. Acton, and R. Allred, 426 I Testing and Analysis.
|Title||:||Engineered Materials Handbook: Adhesives and sealants|
|Author||:||ASM International. Handbook Committee|
|Publisher||:||CRC - 1990|