With the proliferation of packaging technology, failure and reliability have become serious concerns. This invaluable reference details processes that enable detection, analysis and prevention of failures. It provides a comprehensive account of the failures of device packages, discrete component connectors, PCB carriers and PCB assemblies.A schematic of the plasma etching system is shown in Figure 5.7. ... Typical plasma parameters for such purposes are 200 watts of RF power, a chamber pressure of 800 millitorr, and a gas flow of oxygen at 100 sccm, carbon tetrafluoride at 10anbsp;...
|Title||:||Failure Modes and Mechanisms in Electronic Packages|
|Author||:||P. Singh, Puligandla Viswanadham|
|Publisher||:||Springer Science & Business Media - 2012-12-06|