Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. Materials for Advanced Packaging provides a comprehensive review on the most recent developments in advanced packaging technologies including emerging technologies such as 3 dimensional (3D), nanopackaging, and biomedical packaging with a focus on materials and processing aspects. This book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging including: New bonding and joining techniques Novel approaches to make electrical interconnects between integrated circuit (IC) and substrates Latest advances in packaging materials such as lead-free solders, flip chip underfills, epoxy molding compounds, and conductive adhesives. Materials and processing aspects on MEMS and wafer level chip scale packaging. Written by experts in the field of materials and packaging, Materials for Advanced Packaging is a must have book for professionals in semiconductor, digital health and bio-medical areas, and graduate students studying materials science and engineering.Copper thermosonic wire bonding has been successfully used in the connection of the ICs to copper alloy lead frames in dual-in-line packages  for over two decades. ... process from flame-off to wire clamping and breaking (on large diameter wire even manual cutters were used). ... Even as the technology evolved and semi-automatic wirebonders appeared (flame-off and bonding cycle underanbsp;...
|Title||:||Materials for Advanced Packaging|
|Author||:||Daniel Lu, C.P. Wong|
|Publisher||:||Springer Science & Business Media - 2008-12-17|