This handbook provides the most comprehensive, up-to-date and easy-to-apply information on the physics, mechanics, reliability and packaging of micro- and opto-electronic materials. It details their assemblies, structures and systems, and each chapter contains a summary of the state-of-the-art in a particular field. The book provides practical recommendations on how to apply current knowledge and technology to design and manufacture. It further describes how to operate a viable, reliable and cost-effective electronic component or photonic device, and how to make such a device into a successful commercial product.... wire even manual cutters were used). In manual bonding, operator skill was paramount to the fabrication of high-quality, reliable wire bonds. Even as the technology evolved and semi-automatic wirebonders appeared (flame-off and bondinganbsp;...
|Title||:||Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging|
|Author||:||Ephraim Suhir, Y.C. Lee, C.P. Wong|
|Publisher||:||Springer Science & Business Media - 2007-05-26|