State-of-the-art introduction to high-density interconnect technology The first-ever book on this hot topic, Microvias: Low Cost, High Density Interconnects gives you a thorough look at the technology thatas changing the nature of printed circuit boards--and driving the mobile electronic revolution. A qmustq for electronics and mechanical engineers, John Lau and Ricky Leeas intensive introduction to microvia technology expertly covers all major techniques. You get important details on mechanical NC drilling, laser drilling, photo-defined, chemical and plasma etching, and conductive ink formation. You also get a survey of the work of leading companies and their products, including Canon, Compaq, Fujitsu Limited, Gore, Hitachi Chemical Co., Ibiden, IBM, JCI, JVC, KaS (X-Lam), Kyocera/JME, Matsushita, Mitsubishi, NEC, Samsung, Sheldahl, Shinko, Toshiba.For Low Cost, High Density Interconnects John H. Lau, Ricky S. W. Lee ... If space permits, an advanced thermal compound can be dispensed onto each component and a full module cap can be used. ... Often, common heat sinking approaches can be used with SOP to minimize the number and handing of individualanbsp;...
|Author||:||John H. Lau, Ricky S. W. Lee|
|Publisher||:||McGraw Hill Professional - 2001-04-26|