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State-of-the-art introduction to high-density interconnect technology The first-ever book on this hot topic, Microvias: Low Cost, High Density Interconnects gives you a thorough look at the technology thata€™s changing the nature of printed circuit boards--and driving the mobile electronic revolution. A qmustq for electronics and mechanical engineers, John Lau and Ricky Leea€™s intensive introduction to microvia technology expertly covers all major techniques. You get important details on mechanical NC drilling, laser drilling, photo-defined, chemical and plasma etching, and conductive ink formation. You also get a survey of the work of leading companies and their products, including Canon, Compaq, Fujitsu Limited, Gore, Hitachi Chemical Co., Ibiden, IBM, JCI, JVC, KaS (X-Lam), Kyocera/JME, Matsushita, Mitsubishi, NEC, Samsung, Sheldahl, Shinko, Toshiba.For Low Cost, High Density Interconnects John H. Lau, Ricky S. W. Lee ... If space permits, an advanced thermal compound can be dispensed onto each component and a full module cap can be used. ... Often, common heat sinking approaches can be used with SOP to minimize the number and handing of individualanbsp;...

Author:John H. Lau, Ricky S. W. Lee
Publisher:McGraw Hill Professional - 2001-04-26


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