Principles of electronic packaging

Principles of electronic packaging

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46 (1981). 92. L. Mirkova, S. Rashkov, and C. Nanev, aquot;Leveling Mechanism During Bright Acid Copper Plating, aquot; Surface ... K. Heikkla, L. Whitney, G. Peterson , and R. Pylkki, aquot;Factors Affecting Through-Hole Plating of Printed Wiring Boards, aquot; Electronic ... T. Hoar and J. Agar, aquot;Factors in Throwing Power Illustrated by Potential-Current Diagrams, aquot; Dire. Faraday Soc. 1, p. 162 (1947). 112. C. Kasper. aquot;The Theory of the Potential and the Technical Practice of Electrodeposition, aquot; Trans.

Title:Principles of electronic packaging
Author:Donald P. Seraphim, Ronald C. Lasky, Che-Yu Li
Publisher:McGraw-Hill College - 1989


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