Reliability of High Temperature Electronics

Reliability of High Temperature Electronics

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In general, multichip modules or hybrids are used when multiple ICs to be assembled and extremely low signal ... The motivation to develop TAB was to replace manual wire bonding, to provide high-volume, low-cost automated ... But the emergence of automated wire bonder makes this productivity drive less important.

Title:Reliability of High Temperature Electronics
Author:A. Christou
Publisher:RIAC - 1996-01-01


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