Routing in the Third Dimension

Routing in the Third Dimension

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This key text addresses the complex computer chips of tomorrow which will consist of several layers of metal interconnect, making the interconnect within a chip or a multichip module a three dimensional problem. You'll find an insightful approach to the algorithmic, cell design issues in chip and MCM routing with an emphasis on techniques for eliminating routing area.Let Tagt; = {D\, D2, . . . , D/r-i}, such that D, = {di\, di2 diL}, where di, is the density of nets in the jth column of the ith channel. Problem: Select a terminal ... D. L Output: Terminal 266 Routing Algorithms for the Advanced Three-Layer Process Chap. 8.

Title:Routing in the Third Dimension
Author:Naveed A. Sherwani, Siddharth Bhingarde, Anand Panyam
Publisher:John Wiley & Sons - 1995-03-01


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