This issue contains invited and contributed talks on the growth, processing, and characterization of electronic and photonic devices based upon compound semiconductor and oxide materials.The junction temperature of the LED chip will increase when it is driven at higher current. It is due to the bad thermal dissipation of sapphire substrate and silver paste used to package chip. ... is proven to have low productivity due to strain induced cracks or LLO induced device damage, resulting in high fabrication cost (6).
|Title||:||State-of-the-Art Program on Compound Semiconductors 48 (SOTAPOCS 48) -and- ZnO, InZnO, and InGaO Related Materials and Devices for Electronic and Photonic Applications|
|Author||:||M. E. Overberg|
|Publisher||:||The Electrochemical Society - 2008-01-01|