System-on-Package (SOP) is an emerging microelectronic technology that places an entire system on a single chip-size package. Where asystemsa used to be bulky boxes housing hundreds of components, SOP saves interconnection time and heat generation by keep a full system with computing, communications, and consumer functions all in a single chip. Written by the Georgia Tech developers of the technology, this book explains the basic parameters, design functions, and manufacturing issues, showing electronic designers how this radical new packaging technology can be used to solve pressing electronics design challenges.... surface tension, 738 molecular hybridization, 737 MoM (method of moments), 266 Monte Carlo (MC) method, 211, 673 Moore, Gordon E. ... 744 Muller method, 347a348 multiband antennas, 270 multiband architecture, 155, 158, 184a185 multichannel audio serial ports ... 680 multidimensional conduction, 620a622 multifunction SOP substrate reliability digital function high-density wiring reliability, 458anbsp;...
|Title||:||System on Package|
|Publisher||:||McGraw Hill Professional - 2007-07-22|