The assembly of electronic circuit boards has emerged as one of the most significant growth areas for robotics and automated assembly. This comprehensive volume, which is an edited collection of material mostly published in qAssembly Engineeringq and qElectronic Packaging and Productionq, will provide an essential reference for engineers working in this field, including material on Multi Layer Boards, Chip-on-board and numerous case studies. Frank J. Riley is senior vice-president of the Bodine Corporation and a world authority on assembly automation.(C) 1984 Reed Publishing (USA) Inc. which will yield the particle count of the air as it approaches the work location. ... One is by using a light-scattering system, the other is by manually counting particles trapped on a membrane filter byanbsp;...
|Title||:||The Electronics Assembly Handbook|
|Author||:||Frank Riley, Electronic Packaging and Production|
|Publisher||:||Springer Science & Business Media - 2013-06-29|