Addresses the power and thermal management issues in integrated circuits during normal operating conditions and stress operating conditions. This book reviews the significance of the junction temperature as a reliability measure under nominal and burn-in conditions. It concludes with a section on low temperature operation of integrated circuits.8.4 Advanced Cooling Techniques In last two years microprocessors with more than 150 watts power dissipation have been introduced to the market. Under burn-in condition these microprocessors could dissipate even more than 200 watts.
|Title||:||Thermal and Power Management of Integrated Circuits|
|Author||:||Arman Vassighi, Manoj Sachdev|
|Publisher||:||Springer Science & Business Media - 2006-06-01|